A number of new products aimed at addressing requirements for the manufacture and performance of advanced electronics devices, have been showcased.
On display at the 2020 IPC APEX tradeshow in San Diego, California, the products are seen as solutions for the needs of 5G, or fifth generation, wireless technology.
DuPont Interconnect Solutions’ product offerings include:
- Pyralux AG – an all-polyimide, double-sided, copper-clad laminate that is offered in both sheets and rolls with global availability, for use in high-volume consumer, medical and automotive applications.
- Pyralux GPL – an adhesive that is specifically formulated for high-speed, high-frequency flexible circuit applications, with thermal resistance, peel strength and ultraviolet laser drilling process capabilities.
- Riston DI3000 – a multi-wavelength, dry-film photoresist for pattern plating on multi-layer boards. High adhesion and chemical resistance delivers yield by eliminating lifting and breakdown defects in copper, tin or gold.
- Riston DI5100 – a solution for the mSAP process, made for smooth copper high adhesion on isolated resist lines.
- Riston DI9200 – high density interconnect film for print and etch process. High resolution and adhesion, combined with lamination conformation, ensures high yields. Fast photo speed at multiple LDI wavelengths aims to ensure high productivity.
The company provides materials that support all aspects of printed circuit board (PCB) manufacturing for various types of PCBs, including single- or double-sided boards and flexible, rigid-flex, or rigid configurations.